Samsung Electronics (SSNLF) received approval to provide 8 layers HBM3E HBM 3 -band chips (HBM) to NVIDIA (Nasdaq: NVDA), according to a Bloomberg report.
These chips, less advanced than the 12 -layer version, were approved in December 2024 and will be used in NVIDIA IA processors for the Chinese market. Nvidia and Samsung did not comment on the issue. Samsung recently indicated that HBM sales could face temporary constraints in the first quarter of 2025.
The HBM market is currently led by SK Hynix and Samsung, with Micron Technology (NASDAQ: MU) playing a smaller role. SK Hynix was the first to produce HBM3E in 8 -layer in early 2024 and began to provide the 12 -layer version by the end of 2024.
The CFO of Samsung, Rodimcheol Park, said that since the third quarter of 2024, the company has produced HBM3E chips at 8 batteries and 12 batteries, widening the supply to several GPU providers and data centers.
This article appeared for the first time on Gurufocus.
